Intelligent Mobile Cyber-Physical Systems (Euromicro DSD 2019)
• 大类 : 工程技术 - 4区
• 小类 : 计算机：硬件 - 4区
• 小类 : 计算机：理论方法 - 4区
• 小类 : 工程：电子与电气 - 4区
With the development of sensing technologies, computing platforms, machine learning algorithms, and communication infrastructure, intelligent mobile cyber-physical systems (MCPS) are increasingly deployed in the domains of automotive, robotics, aerospace, smart living, healthcare, etc. Design of intelligent MCPS often aims at functional safety, timing predictability, resource efficiency, and performance, where there is a strong interaction among the application software, control algorithms, physical dynamics, programming languages, operating systems, communication protocols, as well as hardware platforms.
The Special Issue on Intelligent Mobile Cyber-Physical Systems of the Microprocessors and Microsystems (MICPRO) journal is devoted to the selected high-quality papers from the 22nd Euromicro Conference on Digital System Design (Euromicro DSD 2019). This special issue addresses all aspects of intelligent MCPS, with emphasis on the automotive/aerospace applications, collaborating intelligence, and mixed-criticality systems.