Call for papers: Special issue on “Recent Advances in Thermal Transport in Porous Media for Engineering Applications”
摘要截稿:
全文截稿: 2020-06-30
影响因子: 4.725
期刊难度:
CCF分类: 无
中科院JCR分区:
• 大类 : 工程技术 - 2区
• 小类 : 能源与燃料 - 2区
• 小类 : 工程:机械 - 2区
• 小类 : 力学 - 2区
• 小类 : 热力学 - 2区
Overview
Porous structures are encountered in almost all disciplines of science and engineering. Thermal transport is one of the most critical topics in engineering applications involving porous media and, as such, a significant research activity has been devoted to this topic over the last decade. Many unique areas of investigation and research trends have recently emerged, including heat transfer within nanopores, coupled fluid flow and heat transfer for nanofluids in porous media, reactive flows with heat transfer inside porous media, multiphase flow and heat transfer with phase change inside porous media, and conjugate heat transfer at the external surface of shrinking porous media. As a result, significant advances in these areas have been reported to the thermal engineering community. The motivation for this Special Issue is to bring together this most up-to-date outstanding in a series of research articles presenting recent advances in the field of thermal transport in porous media.
The aim of this special issue is to offer a high-level platform for world-renown researchers to report their outstanding research outputs in thermal transport in porous media for engineering applications and to inform the readers about future research directions. Experimental, theoretical, and numerical studies are all welcome, ensuring that the topic is covered from all scientific perspectives. Emphasis will be given to studies related to engineering applications. Interdisciplinary and cutting-edge studies will be encouraged. Beyond regular original research articles (10-12 slots), 3-5 slots will be reserved for review and feature articles summarizing the state-of-the-art, and highlighting recent major studies and future directions on thermal transport in porous media for engineering applications.
Interested authors can contact any of the Guest Editors and the Internal Editor with you latest CV to inquire about the suitability of their manuscript for this special issue. The proposed timeline for this special issue is as follows: