Virtual Special Issue Title: Terahertz Physics, Devices & Technologies
摘要截稿:
全文截稿: 2018-12-22
影响因子: 2.045
期刊难度:
CCF分类: 无
中科院JCR分区:
• 大类 : 工程技术 - 3区
• 小类 : 工程:电子与电气 - 4区
• 小类 : 光学 - 4区
• 小类 : 物理:应用 - 4区
Overview
Application potential of THz waves is related to the fact that they easily penetrate most non-metallic materials, offering improved field coverage and allowing for investigation of internal structures or contents of the objects. Also, unlike UV or X-ray, THz waves are harmless to humans and animals, eliminating need for safety measures. Certain sub-THz waves may propagate through sand, fog or snow in conditions difficult for infrared radiation. A multitude of potential applications for THz waves therefore emerges: in communication (to boost information data rate), in industry, agriculture and trade (for non-destructive non-hazardous process monitoring or quality checks), in safety (vision systems for difficult atmospheric conditions) and security (detection of hazards) or health (skin burns and cancerous tissue diagnostic). Enormous potential concerning both basic science and applications makes the THz related science an important axis unifying efforts of large scientific community similarly to Quantum Computing and/or Spintronics.
The7th Russia-Japan-USA-Europe Symposium on Fundamental & Applied Problems of Terahertz Devices & Technologies & 4th TERAMIR International Laboratory Workshop
will be held in September 17 - 21, 2018, in Warsaw, Poland.
The symposium aims to bring together researchers who tackle “Fundamental & Applied Problems in Terahertz Devices & Technologies”, so as to stimulate discussions on the state-of-the-art results and promote the collaborations. The symposium will be conducted together with 4th Workshop of International Laboratory - TERAMIR. This French-Russian-Polish laboratory focuses on THz and IR properties of topological insulators and Dirac matter.
Main conference topics:
High Frequency – THz -carrier nonequilibrium carrier dynamics,
THz properties of 2D materials & their heterostructures,