Special issue: Recent progress in electronic interconnection
摘要截稿:
全文截稿: 2018-12-01
影响因子: 1.535
期刊难度:
CCF分类: 无
中科院JCR分区:
• 大类 : 工程技术 - 4区
• 小类 : 工程:电子与电气 - 4区
• 小类 : 纳米科技 - 4区
• 小类 : 物理:应用 - 4区
Overview
The electronics industry is nearing the limits of traditional CMOS scaling. The requests in capability and functionality of the devices is drastically increasing. Regarding emerging applications of electronic devices, such as healthcare, Industry 4.0, sensor, automotive, and so on, revolutionary changes to interconnect and packaging technologies for smarter usage are progressing.
The scope of this special issue covers leading edge developments and technical innovations across interconnects and packaging spectrum. Topics ranging from materials and processing, assembly and manufacturing, characterization and applied reliability are included. Papers related to interconnect materials, processes and devices are solicited, including (1) 3D IC interconnection; (2) Cu-to-Cu bonding; (3) WBG die attachment; (4) Pb-free solders; (5) micro joining; (6) emerging technologies and materials; (7) phase stability and reliability phenomena, e.g. electromigration, thermomigration, and their physics; and (8) any other important issues for electronic interconnection.