International Test Conference (ITC) is the world’s premier venue dedicated to the electronic test of devices, boards and systems—covering the complete cycle from design verification, designfor-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back to process and design improvement.
The theme of ITC 2019 is “Celebrating 50 Years of Innovation in the Field of Testing”. Over the past 50 years, ITC has been instrumental in innovation, technology development, and establishing partnership between industry and academia. In addition to celebrating 50th ITC, the 2019 program will include three application-specific tracks, Automotive, Security and AI in Test, where multiple sessions will be allocated for each track.
Topics of interest include (but not limited to):
3D/2.5D Test
Adaptive Test in Practice
ATE/Probe Card Design
Advances in Boundary Scan
Bring-Up
Data Driven Methods
Data Exchange and Infrastructure
Defect-oriented Testing
DFM and Test
Diagnosis
Economics of Test
End-to-End Data Analysis
End-to-End System Security
Embedded BIST and DFT
Emerging Defect Mechanisms
Hardware Security and Trust
IoT Testing
Jitter, High-Speed I/O and RF Test
Known-Good-Die testing
Memory Test and Repair
MEMS Testing
Mixed-Signal and Analog Test
New Technologies and Test
On-Chip Test Compression
Online Test
Pre-Silicon Verification
Post- Silicon Validation
Power Issues in Test
Protocol-aware Test
Reliability and Resilience
Scan Based Test
SoC/SiP/NoC Test
Silicon Debug
Simulation and Emulation
System Test (Applications)
System Test (Hardware/Software)
Test-to-Design Feedback
Test Escape Analysis
Test Flow Optimizations
Test Generation and Validation
Test Resource Partitioning
Test Standards
Test Time Analysis and Reduction
Testing High Speed Optics/Photonics
Timing Test
Yield Analysis and Optimization