International Conference on Electronics, Electrical Engineering and Computing
会议地点: Lima, Peru
The IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing – INTERCON 2019 aims to bring together researchers, professionals, students and entrepreneurs to promote the exchange of ideas and the promotion and production of research in various technological fields. INTERCON facilitate the approach, identification and commitment to joint challenges that allow greater access to and development of technologies for the benefit of humanity, as it is the vision of the IEEE.
INTERCON 2019 will be held in Lima, World Heritage Site and Gastronomic Capital of Latin America with 483 years of creation. Museums with great Works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of adventure sports, and the exquisite cuisine gives Peru’s capital an authentic personality and makes tourism in Lima a unique experience in the country.
The Conference Organizing Committee invites you to submit full length original research contributions from engineering professionals from industries, R&D organizations, academic institutions, government departments and research scholars from across the world. The manuscript should not have been published in any journals/magazines or conference proceedings and not under review any of them. All the submitted manuscripts will be sent for peer review and the corresponding author will be notified the outcome of the review process.