International Workshop on System-Level Interconnect Prediction
摘要截稿: 2019-03-22
全文截稿: 2019-03-29
开会时间: 2019-06-02
会议难度:
CCF分类: 无
会议地点: Las Vegas, Nevada, USA
Overview
Technical topics include but are not limited to:
Learning and predictive models for optimizing interconnect at various IC and system design stages
System-level design for FPGAs, NoCs, reconfigurable systems
Design, analysis, and (co)optimization of power and clock networks
Topologies and fabrics of multi- and many-core architectures
Power consumption of interconnects
System level reliability, aging, and thermal issues
Security-aware power/clock delivery and interconnect design
Design-for-manufacturing (DFM) and yield techniques for interconnects
High speed chip-to-chip interconnect
Design and analysis of chip-package interfaces
3D interconnect design and prediction
Applications of interconnects to social, genetic, and biologicalsystems
Emerging interconnect technologies in machine learning platforms & chips