Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, datacenters and Clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.
Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited in the topics listed below.
Themes: -Novel and innovative interconnect architectures -Multi-core processor interconnects -System-on-Chip Interconnects -Advanced chip-to-chip communication technologies -Optical interconnects -Protocols and interfaces for inter-processor communication -Survivability and fault-tolerance of interconnects -High-speed packet processing engines and network processors -System and storage area network architectures and protocols -High-performance host-network interface architectures -High-bandwidth and low-latency I/O -Pb/s switching and routing technologies -Innovative architectures for supporting collective communication -Novel communication architectures to support cloud computing -Centralized and distributed cloud interconnects -Requirements driving high-performance interconnects -Traffic characterization for HPC systems and commercial datacenters -Software for Network/Fabric Bring-up, Configuration and Performance -Management, e.g., OpenFlow or OpenSM -Data Center networking